IP Library › Assignment 063389/0156
Patent Assignment
Reel/Frame 063389/0156

Assignment of Assignor's Interest

Recorded: 2023-04-20 Pages: 3
Assignor
YAO, CHIA-HSIEN
Executed: 2023-02-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device with Backside Spacer and Methods of Forming the Same
Application: 17/694,135 →
Publication: US 2022/0199530
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 20, 2023
From: HUANG, PO-YU; YANG, FU-KAI; WANG, MEI-YUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063389/0086 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 063389 Frame 0086. Assignor(S) Hereby Confirms the Assignment. May 10, 2023
From: HUANG, PO-YU; YANG, FU-KAI; WANG, MEI-YUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 063601/0148 →