IP Library › Assignment 063393/0386
Patent Assignment
Reel/Frame 063393/0386

Assignment of Assignor's Interest

Recorded: 2023-04-20 Pages: 3
Assignors
LIU, TZUAN-HORNG
Executed: 2023-04-13
TSAI, HAO-YI
Executed: 2023-04-13
YU, TSUNG-YUAN
Executed: 2023-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device Package Structure and Manufacturing Method Thereof
Application: 18/098,987 →
Publication: US 2024/0178150
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Execution Date of All Inventors Previously Recorded at Reel: 063393 Frame: 0386. Assignor(S) Hereby Confirms the Assignment. Jan 2, 2024
From: LIU, TZUAN-HORNG; TSAI, HAO-YI; YU, TSUNG-YUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 066176/0427 →