Patent Assignment
Reel/Frame 066176/0427
Corrective Assignment to Correct the the Execution Date of All Inventors Previously Recorded at Reel: 063393 Frame: 0386. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2024-01-02
Pages: 5
Assignors
LIU, TZUAN-HORNG
Executed: 2023-09-11
TSAI, HAO-YI
Executed: 2023-09-12
YU, TSUNG-YUAN
Executed: 2023-09-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Package Structure and Manufacturing Method Thereof
Application:
18/098,987 →
Publication:
US 2024/0178150
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.