Patent Assignment
Reel/Frame 063394/0288
Assignment of Assignor's Interest
Recorded: 2023-04-20
Pages: 4
Assignors
PENG, SHIH-WEI
Executed: 2020-12-06
LIN, WEI-CHENG
Executed: 2020-12-21
CHUANG, CHENG-CHI
Executed: 2020-12-06
TZENG, JIANN-TYNG
Executed: 2020-12-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method for Forming the Same