Patent Assignment
Reel/Frame 063422/0956
Assignment of Assignor's Interest
Recorded: 2023-04-24
Pages: 3
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, 319-1221, JAPAN
Covered Property
(1)
Semiconductor Device Including Semiconductor Element and Lead-Free Solder Bonding Material and Method for Manufacturing the Same
Application:
18/033,543 →
Publication:
US 2023/0402420
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.