IP Library › Granted Patent US 12,721,207
Granted Patent B2
US 12,721,207 · App. 18/033,543 · Granted Aug 25, 2026

Semiconductor device including semiconductor element and lead-free solder bonding material and method for manufacturing the same

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Quick Facts
Patent No.
US 12,721,207
App. No.
18/033,543
Filed
Apr 24, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2892
USPC
257/666
Assignments (2)
CHANGE OF NAME Recorded Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2023
From: IKEDA, OSAMU; NAKAMURA, MASATO
To: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Reel/Frame 063422/0956 →
Priority Claims (1)
JP 2020-213897 · Dec 23, 2020 · national
Continuity (1)
Related Publication 20230402420A1 · Dec 14, 2023
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