Patent Assignment
Reel/Frame 063444/0084
Assignment of Assignor's Interest
Recorded: 2023-04-26
Pages: 7
Assignors
JEON, YOONYOUNG
Executed: 2023-03-02
KIM, YOUNGMIN
Executed: 2023-03-02
OH, JOON SEOK
Executed: 2023-03-02
LEE, CHANGBO
Executed: 2023-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structure and Method of Fabricating the Same