Patent Assignment
Reel/Frame 063496/0233
Assignment of Assignor's Interest
Recorded: 2023-05-01
Pages: 6
Assignors
HOU, HAO-CHENG
Executed: 2022-08-29
WANG, TSUNG-DING
Executed: 2022-09-08
CHENG, JUNG WEI
Executed: 2022-09-08
LIANG, YU-MIN
Executed: 2022-09-12
LEE, CHIEN-HSUN
Executed: 2022-09-12
HOU, SHANG-YUN
Executed: 2022-09-16
CHEN, WEI-YU
Executed: 2022-09-18
FLESHMAN, COLLIN JORDON
Executed: 2022-09-18
PAN, KUO-LUNG
Executed: 2022-09-18
CHUN, SHU-RONG
Executed: 2023-02-12
LIN, SHENG-CHI
Executed: 2023-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same
Application:
18/151,583 →
Publication:
US 2023/0307375