Patent Assignment
Reel/Frame 063501/0720
Assignment of Assignor's Interest
Recorded: 2023-05-02
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Package Substrate Including Memory Bridge Die and Methods for Forming the Same
Application:
18/310,557 →
Publication:
US 2024/0113030