IP Library › Assignment 063516/0722
Patent Assignment
Reel/Frame 063516/0722

Assignment of Assignor's Interest

Recorded: 2023-05-03 Pages: 11
Assignors
LIANG, SHUEN-SHIN
Executed: 2021-04-25
WANG, CHEN-HAN
Executed: 2021-04-25
LIN, KENG-CHU
Executed: 2021-04-25
UENO, TETSUJI
Executed: 2021-05-05
CHEN, TING-TING
Executed: 2021-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Seal Material for Air Gaps in Semiconductor Devices
Application: 18/311,066 →
Publication: US 2023/0268387
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the Assignee Name Previously Recorded at Reel: 63516 Frame: 722. Assignor(S) Hereby Confirms the Assignment. Feb 20, 2025
From: LIANG, SHUEN-SHIN; WANG, CHEN-HAN; LIN, KENG-CHU; UENO, TETSUJI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 070274/0426 →