Corrective Assignment to Correct the Correct the Assignee Name Previously Recorded at Reel: 63516 Frame: 722. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2025-02-20 Pages: 13

Assignors

LIANG, SHUEN-SHIN

Executed: 2021-04-25

WANG, CHEN-HAN

Executed: 2021-04-25

LIN, KENG-CHU

Executed: 2021-04-25

UENO, TETSUJI

Executed: 2021-05-05

CHEN, TING-TING

Executed: 2021-04-28

Assignee

NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Seal Material for Air Gaps in Semiconductor Devices

Patent: 12,324,200 →

Application: 18/311,066 →

Publication: US 2023/0268387

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.