IP Library Assignment 063527/0103
Patent Assignment
Reel/Frame 063527/0103

Assignment of Assignor's Interest

Recorded: 2023-05-03 Pages: 3
Assignors
DING, ZHICHENG
Executed: 2018-12-11
LIN, BIN
Executed: 2018-12-17
SHE, YONG
Executed: 2018-12-08
XU, ZHIJUN
Executed: 2018-12-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Interconnect Structure Fabricated Using Lithographic and Deposition Processes
Application: 17/053,144 →
Publication: US 2021/0057326
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072850/0834 →