Patent Assignment
Reel/Frame 063564/0402
Assignment of Assignor's Interest
Recorded: 2023-05-08
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/312,331 →
Publication:
US 2024/0120318