Patent Assignment
Reel/Frame 063668/0087
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 3
Assignors
LIN, YI-HSIUNG
Executed: 2018-09-18
CHIU, YI-HSUN
Executed: 2018-09-07
CHANG, SHANG-WEN
Executed: 2018-09-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Contact Structures