Patent Assignment
Reel/Frame 063675/0042
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 3
Assignors
CHOI, HO SAM
Executed: 2023-04-26
SIM, KYU JEONG
Executed: 2023-04-26
CHOI, HYO SUNG
Executed: 2023-04-26
PARK, JUNG JIN
Executed: 2023-04-26
LEE, JONG HO
Executed: 2023-04-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component