Patent Assignment
Reel/Frame 063699/0625
Assignment of Assignor's Interest
Recorded: 2023-05-19
Pages: 16
Assignors
LIM, MIN SUET
Executed: 2022-05-30
CHUAH, TIN POAY
Executed: 2022-05-31
LIM, YEW SAN
Executed: 2022-05-31
KU, JEFF
Executed: 2022-05-31
LOO, TWAN SING
Executed: 2022-06-07
KHOO, POH BOON
Executed: 2022-05-31
SIR, JIUN HANN
Executed: 2022-06-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Bottom Side Thermal Solution with Discrete Hat-Shaped Copper Spreader Component
Application:
17/834,641 →
Publication:
US 2023/0397323