Package bottom side thermal solution with discrete hat-shaped copper spreader component
Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.
1 . A printed circuit board (PCB), comprising:
a substrate with a first surface and a second surface opposite from the first surface;
a first slot through a thickness of the substrate;
a second slot through the thickness of the substrate, wherein the first slot is parallel to the second slot;
a third slot through the thickness of the substrate;
a first metal plate, wherein the first metal plate comprises:
a first portion over the first surface of the substrate between the first slot and the second slot;
a second portion connected to the first portion, wherein the second portion is in the first slot; and
a third portion connected to the first portion, wherein the third portion is in the second slot; and
a second metal plate, wherein the second metal plate comprises:
a fourth portion on the first surface of the substrate between the second slot and the third slot:
a fifth portion connected to the fourth portion, wherein the fifth portion is in the second slot; and
a sixth portion connected to the fourth portion, wherein the sixth portion is in the third slot.
2 . The PCB of claim 1 , wherein the first portion of the first metal plate is thermally coupled to a conductive layer exposed on the first surface of the substrate.
3 . The PCB of claim 1 , wherein the first metal plate further comprises:
a seventh portion connected to the second portion, wherein the seventh portion contacts the second surface of the substrate; and
an eighth portion connected to the third portion, wherein the eighth portion contacts the second surface of the substrate.
4 . The PCB of claim 3 , wherein the seventh portion and the eighth portion contact metal exposed on the second surface of the substrate.
5 . The PCB of claim 4 , wherein the metal exposed on the second surface of the substrate is configured to be grounded.
6 . The PCB of claim 3 , further comprising:
a graphite layer on the seventh portion and the eighth portion.
7 . The PCB of claim 1 , wherein the metal plate comprises copper.
8 . An electronic system, comprising:
a printed circuit board (PCB) with a first surface and a second surface opposite from the first surface, wherein slots extend through a thickness of the PCB;
a first heat spreader inserted through the slots of the PCB, wherein a bottom portion of the first heat spreader is folded against the second surface of the PCB;
a second heat spreader inserted through the slots of the PCB, wherein a bottom portion of the heat spreader is folded against the second surface of the PCB, and wherein the second heat spreader and the heat spreader share one of the slots; and
an electronic package coupled to the PCB, wherein the electronic package comprises:
a die between a package substrate and the PCB, and wherein the die is thermally coupled to the first heat spreader by a thermal interface material (TIM).
9 . The electronic system of claim 8 , further comprising:
a gasket around the die between the package substrate and the PCB.
10 . The electronic system of claim 9 , further comprising:
a liquid TIM disposed around the die and into the shared slot.
11 . The electronic system of claim 8 , further comprising:
a graphite layer on the bottom portion of the first heat spreader.
12 . The electronic system of claim 8 , further comprising:
a second die on the package substrate opposite from the die.
13 . The electronic system of claim 8 , wherein the first heat spreader comprises copper.
14 . The electronic system of claim 8 , wherein the bottom portion of the first heat spreader contacts a metal on the second surface of the PCB.
15 . A printed circuit board (PCB), comprising:
a substrate with a first surface and a second surface opposite from the first surface;
a first slot through a thickness of the substrate;
a second slot through the thickness of the substrate, wherein the first slot is parallel to the second slot;
a metal plate, wherein the metal plate comprises:
a first portion over the first surface of the substrate between the first slot and the second slot;
a second portion connected to the first portion, wherein the second portion is in the first slot;
a third portion connected to the first portion, wherein the third portion is in the second slot;
a fourth portion connected to the second portion, wherein the fourth portion contacts the second surface of the substrate; and
a fifth portion connected to the third portion, wherein the fifth portion contacts the second surface of the substrate; and
a graphite layer on the fourth portion and the fifth portion.
16 . An electronic system, comprising:
a printed circuit board (PCB) with a first surface and a second surface opposite from the first surface, wherein slots extend through a thickness of the PCB;
a heat spreader inserted through the slots of the PCB, wherein a bottom portion of the heat spreader is folded against the second surface of the PCB;
a graphite layer on the bottom portion of the heat spreader; and
an electronic package coupled to the PCB, wherein the electronic package comprises:
a die between a package substrate and the PCB, and wherein the die is thermally coupled to the heat spreader by a thermal interface material (TIM).