Patent Assignment
Reel/Frame 063699/0956
Assignment of Assignor's Interest
Recorded: 2023-05-19
Pages: 3
Assignors
CHENG, YI-HUA
Executed: 2022-04-07
CHIU, YA-WEN
Executed: 2022-03-16
CHAN, YI CHE
Executed: 2022-03-16
TAN, LUN-KUANG
Executed: 2022-03-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof