Patent Assignment
Reel/Frame 063722/0439
Assignment of Assignor's Interest
Recorded: 2023-05-23
Pages: 3
Assignors
HUANG, SHENG-FENG
Executed: 2023-04-10
TZENG, JIANN-TYNG
Executed: 2023-04-23
PENG, SHIH-WEI
Executed: 2023-04-10
CHEN, YU-RONG
Executed: 2023-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same