Patent Assignment
Reel/Frame 063772/0987
Assignment of Assignor's Interest
Recorded: 2023-05-26
Pages: 4
Assignors
PARK, SANGJINE
Executed: 2023-01-25
PARK, JIHWAN
Executed: 2023-01-25
LEE, KUNTACK
Executed: 2023-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method
Application:
18/120,916 →
Publication:
US 2024/0036476