Patent Assignment
Reel/Frame 063775/0443
Assignment of Assignor's Interest
Recorded: 2023-05-26
Pages: 11
Assignors
LI, DENGFENG
Executed: 2023-05-15
ZHANG, WENLONG
Executed: 2023-05-24
BU, KUNLIANG
Executed: 2023-05-12
Assignee
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
35/F, TENCENT BUILDING, KEJIZHONGYI ROAD, MIDWEST DISTRICT OF HI-TECH PARK, NANSHAN DISTRICT, SHENZHEN, GUANGDONG, 518057, CHINA
Covered Property
(1)
Through Silicon via Interconnection Structure and Method of Forming Same, and Quantum Computing Device