Patent Assignment
Reel/Frame 063786/0518
Assignment of Assignor's Interest
Recorded: 2023-05-29
Pages: 4
Assignors
LAI, PO-YING
Executed: 2022-05-16
CHEN, SHUO-MAO
Executed: 2022-05-15
LIU, MONSEN
Executed: 2022-05-15
TSAI, SHANG-LUN
Executed: 2022-05-16
JENG, SHIN-PUU
Executed: 2022-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Hybrid Organic and Non-Organic Interposer with Embedded Component in Molding Structure and Methods for Forming the Same
Application:
17/748,345 →
Publication:
US 2023/0137691