Assignment of Assignor's Interest

Recorded: 2023-05-29 Pages: 4

Assignor

SEYAMA, KOHEI

Executed: 2023-04-28

Assignee

SHINKAWA LTD.

51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN

Covered Property (1)

Bonding Apparatus, Bonding Method, and Computer Readable Storage Medium

Application: 18/039,275 →

Publication: US 2024/0304592

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.