Merger

Recorded: 2026-04-21 Pages: 17

Assignor

SHINKAWA LTD.

Executed: 2025-07-01

Assignee

YAMAHA ROBOTICS CO., LTD.

51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN

Covered Property (1)

Bonding Apparatus, Bonding Method, and Computer Readable Storage Medium

Application: 18/039,275 →

Publication: US 2024/0304592

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.