Patent Assignment
Reel/Frame 063807/0115
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 2
Assignor
SUZUKI, RYOJI
Executed: 2019-07-10
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Solid State Image Sensor Having a Grid-Patterned Inter-Pixel Isolation Section Separating the Photoelectric Conversion Sections of Each of the Pixels from One Another and Provided with Protruding Sections