Patent Assignment
Reel/Frame 063814/0610
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 5
Assignors
KANG, INGOO
Executed: 2023-04-24
JEON, OSEOB
Executed: 2023-05-30
IM, SEUNGWON
Executed: 2023-04-17
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Method of Direct Cooling Using a Conductive Strip
Application:
18/324,362 →
Publication:
US 2024/0395662