Patent Assignment
Reel/Frame 063836/0808
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 6
Assignors
PARK, HAN TEO
Executed: 2023-05-25
HAN, DEOK SU
Executed: 2023-05-25
KWON, JANG KUK
Executed: 2023-05-25
HONG, SEUNG CHUL
Executed: 2023-05-25
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Composition for Semiconductor Processing,Method for Preparing Polishing Composition, and Method for Manufacturing Semiconductor Element to Which Polishing Composition Is Applied
Application:
18/255,600 →
Publication:
US 2024/0043718
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.