Patent Assignment
Reel/Frame 073510/0333
Assignment of Assignor's Interest
Recorded: 2026-01-20
Pages: 5
Assignor
SK ENPULSE CO., LTD
Executed: 2025-12-10
Assignee
YCCHEM CO., LTD.
174-12 YUSEORI-GIL, SEONNAM-MYEON, SEONGJU-GUN, GYEONGSANGBUK-DO, 40046, KOREA, REPUBLIC OF
Covered Properties
(9)
Polishing Composition for Semiconductor Processing,Method for Preparing Polishing Composition, and Method for Manufacturing Semiconductor Element to Which Polishing Composition Is Applied
Application:
18/255,600 →
Publication:
US 2024/0043718
Polishing Composition for Semiconductor Processing,Method for Preparing Polishing Composition, and Method for Manufacturing Semiconductor Element to Which Polishing Composition Is Applied
Application:
18/255,958 →
Publication:
US 2024/0043719
Composition for Semiconductor Process, Method for Preparing the Same and Method for Preparing Semiconductor Device Using the Same
Application:
18/099,031 →
Publication:
US 2023/0227696
Polishing Compostion for Semiconductor Process, Manufacturing Method of Polishing Composition and Method for Manufacturing Semiconductor Device by Using the Same
Application:
18/043,451 →
Publication:
US 2023/0332014
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application:
17/870,333 →
Publication:
US 2023/0040931
Polishing Composition for Semiconductor Process and Method for Manufacturing Semiconductor Device by Using the Same
Application:
17/712,945 →
Publication:
US 2022/0325139
Polishing Composition for Semiconductor Processing Polishing Composition Preparation Method, and Semiconductor Device Manufacturing Method to Which Polishing Composition Is Applied
Polishing Composition for Semiconductor Process and Method for Manufacturing Semiconductor Device by Using the Same
Composition for Semiconductor Processing and Method of Fabricating Semiconductor Device Using the Same
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 7, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 058571/0783 →
Assignment of Assignor's Interest
Apr 4, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO; KWON, JANG KUK
To: SKC SOLMICS CO., LTD.
Reel/Frame 059493/0628 →
Assignment of Assignor's Interest
May 1, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; KWON, JANG KUK; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 059745/0216 →
Assignment of Assignor's Interest
Jul 21, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO; KIM, KYU HUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 060582/0380 →
Assignment of Assignor's Interest
Jan 19, 2023
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO; KIM, HWAN CHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 062426/0052 →
Assignment of Assignor's Interest
Feb 28, 2023
From: PARK, HAN TEO; HAN, DEOK SU; KWON, JANG KUK; HONG, SEUNG CHUL
To: SKC SOLMICS CO., LTD.
Reel/Frame 062828/0523 →
Change of Name
May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest
Jun 2, 2023
From: PARK, HAN TEO; HAN, DEOK SU; KWON, JANG KUK; HONG, SEUNG CHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 063836/0808 →
Assignment of Assignor's Interest
Jun 2, 2023
From: PARK, HAN TEO; HAN, DEOK SU; KWON, JANG KUK; HONG, SEUNG CHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 063844/0708 →
Assignment of Assignor's Interest
Jun 5, 2023
From: PARK, HAN TEO; HAN, DEOK SU; KWON, JANG KUK; HONG, SEUNG CHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 063854/0612 →