IP Library Assignment 062828/0523
Patent Assignment
Reel/Frame 062828/0523

Assignment of Assignor's Interest

Recorded: 2023-02-28 Pages: 6
Assignors
PARK, HAN TEO
Executed: 2023-02-15
HAN, DEOK SU
Executed: 2023-02-15
KWON, JANG KUK
Executed: 2023-02-02
HONG, SEUNG CHUL
Executed: 2023-02-15
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Compostion for Semiconductor Process, Manufacturing Method of Polishing Composition and Method for Manufacturing Semiconductor Device by Using the Same
Application: 18/043,451 →
Publication: US 2023/0332014
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jan 20, 2026
From: SK ENPULSE CO., LTD
To: YCCHEM CO., LTD.
Reel/Frame 073510/0333 →