IP Library › Assignment 063530/0303
Patent Assignment
Reel/Frame 063530/0303

Change of Name

Recorded: 2023-05-03 Pages: 6
Assignor
SKC SOLMICS CO., LTD.
Executed: 2023-01-02
Assignee
SK ENPULSE CO., LTD.
1043, (JANGDANG-DONG), GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties (23)
Polishing Composition for Semiconductor Process and Method for Manufacturing Semiconductor Device by Using the Same
Application: 17/734,073 →
Publication: US 2022/0363948
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application: 17/870,333 →
Publication: US 2023/0040931
Polishing Composition for Semiconductor Process and Method for Manufacturing Semiconductor Device by Using the Same
Application: 17/712,945 →
Publication: US 2022/0325139
Composition for Semiconductor Processing and Method of Fabricating Semiconductor Device Using the Same
Application: 17/570,230 →
Publication: US 2022/0220340
Polishing System, Polishing Pad and Method of Manufacturing Semiconductor Device
Application: 17/824,086 →
Publication: US 2022/0379427
Polishing Device and Method for Manufacturing Semiconductor Device
Application: 17/886,529 →
Publication: US 2023/0047113
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Application: 17/470,214 →
Publication: US 2022/0072678
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Application: 17/520,206 →
Publication: US 2022/0143778
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application: 17/564,742 →
Publication: US 2022/0203496
Polishing Pad, Manufacturing Method Thereof and Preparing Method of Semiconductor Device Using the Same
Application: 17/488,859 →
Publication: US 2022/0097201
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Application: 17/693,031 →
Publication: US 2022/0288743
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application: 17/735,244 →
Publication: US 2022/0371155
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Application: 17/467,671 →
Publication: US 2022/0073694
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Application: 17/487,045 →
Publication: US 2022/0097197
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application: 17/993,679 →
Publication: US 2023/0197482
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Application: 17/963,380 →
Publication: US 2023/0111352
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Application: 17/963,544 →
Publication: US 2023/0110921
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application: 17/874,989 →
Publication: US 2023/0052322
Polishing Pad and Method for Manufacturing Semiconductor Device Using the Same
Application: 17/856,649 →
Publication: US 2023/0059394
Polishing Pad, Method for Manufacturing the Same, and Method for Manufacturing Semiconductor Device Using the Same
Application: 17/736,784 →
Publication: US 2022/0355436
Polishing Pad Sheet, Polishing Pad, and Method for Manufacturing Semiconductor Device
Application: 17/544,639 →
Publication: US 2022/0176514
Method for Refreshing Polishing Pad, Method for Manufacturing Semiconductor Device Using the Same and Apparatus for Manufacturing Semiconductor Device
Application: 17/946,528 →
Publication: US 2023/0091382
Polishing Compostion for Semiconductor Process, Manufacturing Method of Polishing Composition and Method for Manufacturing Semiconductor Device by Using the Same
Application: 18/043,451 →
Publication: US 2023/0332014
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 7, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON; JEONG, YONG JU
To: SKC SOLMICS CO., LTD.
Reel/Frame 057436/0355 →
Assignment of Assignor's Interest Sep 9, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 057988/0248 →
Assignment of Assignor's Interest Sep 28, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; KYUN, MYUNG OK; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 057619/0282 →
Assignment of Assignor's Interest Sep 29, 2021
From: YUN, JONG WOOK; AHN, JAE IN; JOENG, EUN SUN; HEO, HYE YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 057641/0035 →
Assignment of Assignor's Interest Nov 5, 2021
From: HEO, HYE YOUNG; SEO, JANG WON; AHN, JAE IN; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 058034/0526 →
Assignment of Assignor's Interest Dec 7, 2021
From: YUN, SUNG HOON; KIM, KYUNG HWAN; AHN, JAE IN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 058327/0447 →
Assignment of Assignor's Interest Dec 29, 2021
From: YUN, JONG WOOK; HEO, HYE YOUNG; JOENG, EUN SUN; AHN, JAE IN
To: SKC SOLMICS CO., LTD.
Reel/Frame 058500/0779 →
Assignment of Assignor's Interest Jan 7, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 058571/0783 →
Assignment of Assignor's Interest Mar 11, 2022
From: YUN, JONG WOOK; JOENG, EUN SUN; YUN, SUNG HOON; HEO, HYE YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059245/0829 →
Assignment of Assignor's Interest Apr 4, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO; KWON, JANG KUK
To: SKC SOLMICS CO., LTD.
Reel/Frame 059493/0628 →
Assignment of Assignor's Interest May 1, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; KWON, JANG KUK; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 059745/0216 →
Assignment of Assignor's Interest May 3, 2022
From: YUN, SUNG HOON; AHN, JAE IN; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059792/0444 →
Assignment of Assignor's Interest May 3, 2022
From: YUN, SUNG HOON; AHN, JAE IN; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059792/0571 →
Assignment of Assignor's Interest May 4, 2022
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON; MOON, SU YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059817/0050 →
Assignment of Assignor's Interest May 25, 2022
From: AHN, JAE IN; KIM, KYUNG HWAN; MA, SEONG HWAN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060011/0429 →
Assignment of Assignor's Interest Jul 1, 2022
From: YUN, SUNG HOON; SEO, JANG WON; HEO, HYE YOUNG; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 060425/0648 →
Assignment of Assignor's Interest Jul 21, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; PARK, HAN TEO; KIM, KYU HUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 060582/0380 →
Assignment of Assignor's Interest Jul 27, 2022
From: YUN, SUNG HOON; AHN, JAE IN; KIM, KYUNG HWAN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060645/0619 →
Assignment of Assignor's Interest Aug 12, 2022
From: AHN, JAE IN; YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060791/0291 →
Assignment of Assignor's Interest Oct 11, 2022
From: SEO, JANG WON; JOENG, EUN SUN; YUN, SUNG HOON; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 061379/0078 →
Assignment of Assignor's Interest Oct 11, 2022
From: SEO, JANG WON; YUN, SUNG HOON; JOENG, EUN SUN; AHN, JAE IN
To: SKC SOLMICS CO., LTD.
Reel/Frame 061376/0240 →
Assignment of Assignor's Interest Nov 23, 2022
From: IM, CHANG GYU; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNG HOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 061868/0066 →
Assignment of Assignor's Interest Dec 22, 2022
From: MYUNG, KANG SIK
To: SKC SOLMICS CO., LTD.
Reel/Frame 062188/0420 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →
Assignment of Assignor's Interest Jan 20, 2026
From: SK ENPULSE CO., LTD
To: YCCHEM CO., LTD.
Reel/Frame 073510/0333 →