IP Library › Assignment 061379/0078
Patent Assignment
Reel/Frame 061379/0078

Assignment of Assignor's Interest

Recorded: 2022-10-11 Pages: 6
Assignors
SEO, JANG WON
Executed: 2022-10-06
JOENG, EUN SUN
Executed: 2022-10-06
YUN, SUNG HOON
Executed: 2022-10-06
YUN, JONG WOOK
Executed: 2022-10-06
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Application: 17/963,544 →
Publication: US 2023/0110921
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →