Patent Assignment
Reel/Frame 071308/0411
Assignment of Assignor's Interest
Recorded: 2025-06-04
Pages: 4
Assignor
SK ENPULSE CO., LTD.
Executed: 2025-04-29
Assignee
ENPULSE CO., LTD.
3-3F, 112, SEONGGEO-GIL, SEONGGEO-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF
Covered Properties
(18)
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Application:
17/487,045 →
Publication:
US 2022/0097197
Polishing Pad, Manufacturing Method Thereof and Preparing Method of Semiconductor Device Using the Same
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application:
17/564,742 →
Publication:
US 2022/0203496
Polishing Pad Sheet, Polishing Pad, and Method for Manufacturing Semiconductor Device
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Application:
17/693,031 →
Publication:
US 2022/0288743
Polishing System, Polishing Pad and Method of Manufacturing Semiconductor Device
Polishing Pad, Method for Manufacturing the Same, and Method for Manufacturing Semiconductor Device Using the Same
Application:
17/736,784 →
Publication:
US 2022/0355436
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application:
17/735,244 →
Publication:
US 2022/0371155
Polishing Device and Method for Manufacturing Semiconductor Device
Application:
17/886,529 →
Publication:
US 2023/0047113
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application:
17/874,989 →
Publication:
US 2023/0052322
Polishing Pad and Method for Manufacturing Semiconductor Device Using the Same
Application:
17/856,649 →
Publication:
US 2023/0059394
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Application:
17/993,679 →
Publication:
US 2023/0197482
Polishing Pad and Method for Manufacturing Semiconductor Device Using the Same
Application:
19/072,828 →
Publication:
US 2025/0282020
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 7, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON; JEONG, YONG JU
To: SKC SOLMICS CO., LTD.
Reel/Frame 057436/0355 →
Assignment of Assignor's Interest
Sep 9, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 057988/0248 →
Assignment of Assignor's Interest
Sep 28, 2021
From: JOENG, EUN SUN; YUN, JONG WOOK; KYUN, MYUNG OK; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 057619/0282 →
Assignment of Assignor's Interest
Sep 29, 2021
From: YUN, JONG WOOK; AHN, JAE IN; JOENG, EUN SUN; HEO, HYE YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 057641/0035 →
Assignment of Assignor's Interest
Nov 5, 2021
From: HEO, HYE YOUNG; SEO, JANG WON; AHN, JAE IN; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 058034/0526 →
Assignment of Assignor's Interest
Dec 7, 2021
From: YUN, SUNG HOON; KIM, KYUNG HWAN; AHN, JAE IN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 058327/0447 →
Assignment of Assignor's Interest
Dec 29, 2021
From: YUN, JONG WOOK; HEO, HYE YOUNG; JOENG, EUN SUN; AHN, JAE IN
To: SKC SOLMICS CO., LTD.
Reel/Frame 058500/0779 →
Assignment of Assignor's Interest
Mar 11, 2022
From: YUN, JONG WOOK; JOENG, EUN SUN; YUN, SUNG HOON; HEO, HYE YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059245/0829 →
Assignment of Assignor's Interest
May 3, 2022
From: YUN, SUNG HOON; AHN, JAE IN; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059792/0571 →
Assignment of Assignor's Interest
May 3, 2022
From: YUN, SUNG HOON; AHN, JAE IN; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059792/0444 →
Assignment of Assignor's Interest
May 4, 2022
From: JOENG, EUN SUN; YUN, JONG WOOK; SEO, JANG WON; MOON, SU YOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059817/0050 →
Assignment of Assignor's Interest
May 25, 2022
From: AHN, JAE IN; KIM, KYUNG HWAN; MA, SEONG HWAN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060011/0429 →
Assignment of Assignor's Interest
Jul 1, 2022
From: YUN, SUNG HOON; SEO, JANG WON; HEO, HYE YOUNG; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 060425/0648 →
Assignment of Assignor's Interest
Jul 27, 2022
From: YUN, SUNG HOON; AHN, JAE IN; KIM, KYUNG HWAN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060645/0619 →
Assignment of Assignor's Interest
Aug 12, 2022
From: AHN, JAE IN; YUN, JONG WOOK; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060791/0291 →
Assignment of Assignor's Interest
Oct 11, 2022
From: SEO, JANG WON; JOENG, EUN SUN; YUN, SUNG HOON; YUN, JONG WOOK
To: SKC SOLMICS CO., LTD.
Reel/Frame 061379/0078 →
Assignment of Assignor's Interest
Oct 11, 2022
From: SEO, JANG WON; YUN, SUNG HOON; JOENG, EUN SUN; AHN, JAE IN
To: SKC SOLMICS CO., LTD.
Reel/Frame 061376/0240 →
Assignment of Assignor's Interest
Nov 23, 2022
From: IM, CHANG GYU; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNG HOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 061868/0066 →
Assignment of Assignor's Interest
Dec 22, 2022
From: MYUNG, KANG SIK
To: SKC SOLMICS CO., LTD.
Reel/Frame 062188/0420 →
Change of Name
May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest
Mar 7, 2025
From: YOON, JONG WOOK; SEO, JANG WON; MOON, SU YOUNG
To: SK ENPULSE CO., LTD.
Reel/Frame 070431/0509 →