Patent Assignment
Reel/Frame 057436/0355
Assignment of Assignor's Interest
Recorded: 2021-09-07
Pages: 7
Assignors
JOENG, EUN SUN
Executed: 2021-09-02
YUN, JONG WOOK
Executed: 2021-09-02
SEO, JANG WON
Executed: 2021-09-02
JEONG, YONG JU
Executed: 2021-09-02
KIM, SEUNG KYUN
Executed: 2021-09-02
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.