IP Library › Assignment 058500/0779
Patent Assignment
Reel/Frame 058500/0779

Assignment of Assignor's Interest

Recorded: 2021-12-29 Pages: 6
Assignors
YUN, JONG WOOK
Executed: 2021-12-17
HEO, HYE YOUNG
Executed: 2021-12-17
JOENG, EUN SUN
Executed: 2021-12-17
AHN, JAE IN
Executed: 2021-12-17
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application: 17/564,742 →
Publication: US 2022/0203496
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →