IP Library › Assignment 058034/0526
Patent Assignment
Reel/Frame 058034/0526

Assignment of Assignor's Interest

Recorded: 2021-11-05 Pages: 6
Assignors
HEO, HYE YOUNG
Executed: 2021-10-28
SEO, JANG WON
Executed: 2021-10-28
AHN, JAE IN
Executed: 2021-10-28
YUN, JONG WOOK
Executed: 2021-10-28
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Application: 17/520,206 →
Publication: US 2022/0143778
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →