Patent Assignment
Reel/Frame 057641/0035
Assignment of Assignor's Interest
Recorded: 2021-09-29
Pages: 7
Assignors
YUN, JONG WOOK
Executed: 2021-09-27
AHN, JAE IN
Executed: 2021-09-27
JOENG, EUN SUN
Executed: 2021-09-27
HEO, HYE YOUNG
Executed: 2021-09-27
SEO, JANG WON
Executed: 2021-09-27
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad, Manufacturing Method Thereof and Preparing Method of Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.