IP Library › Assignment 060791/0291
Patent Assignment
Reel/Frame 060791/0291

Assignment of Assignor's Interest

Recorded: 2022-08-12 Pages: 6
Assignors
AHN, JAE IN
Executed: 2022-08-02
YUN, JONG WOOK
Executed: 2022-08-02
JOENG, EUN SUN
Executed: 2022-08-02
SEO, JANG WON
Executed: 2022-08-02
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Device and Method for Manufacturing Semiconductor Device
Application: 17/886,529 →
Publication: US 2023/0047113
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →