IP Library › Assignment 057619/0282
Patent Assignment
Reel/Frame 057619/0282

Assignment of Assignor's Interest

Recorded: 2021-09-28 Pages: 7
Assignors
JOENG, EUN SUN
Executed: 2021-09-02
YUN, JONG WOOK
Executed: 2021-09-02
KYUN, MYUNG OK
Executed: 2021-09-02
SEO, JANG WON
Executed: 2021-09-02
RYU, JI YEON
Executed: 2021-09-02
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad and Method of Fabricating Semiconductor Device Using the Same
Application: 17/487,045 →
Publication: US 2022/0097197
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →