Patent Assignment
Reel/Frame 059245/0829
Assignment of Assignor's Interest
Recorded: 2022-03-11
Pages: 7
Assignors
YUN, JONG WOOK
Executed: 2022-03-02
JOENG, EUN SUN
Executed: 2022-03-02
YUN, SUNG HOON
Executed: 2022-03-02
HEO, HYE YOUNG
Executed: 2022-03-02
SEO, JANG WON
Executed: 2022-03-02
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad, Method for Producing the Same and Method of Fabricating Semiconductor Device Using the Same
Application:
17/693,031 →
Publication:
US 2022/0288743
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.