Assignment of Assignor's Interest

Recorded: 2022-11-23 Pages: 6

Assignors

IM, CHANG GYU

Executed: 2022-11-18

SEO, JANG WON

Executed: 2022-11-18

YUN, JONG WOOK

Executed: 2022-11-18

YUN, SUNG HOON

Executed: 2022-11-18

Assignee

SKC SOLMICS CO., LTD.

1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF

Covered Property (1)

Polishing Pad and Method for Manufacturing Semiconductor Device Using Same

Application: 17/993,679 →

Publication: US 2023/0197482

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.