Patent Assignment
Reel/Frame 062188/0420
Assignment of Assignor's Interest
Recorded: 2022-12-22
Pages: 2
Assignor
MYUNG, KANG SIK
Executed: 2022-12-19
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing System, Polishing Pad and Method of Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 25, 2022
From: AHN, JAE IN; KIM, KYUNG HWAN; MA, SEONG HWAN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060011/0429 →
Change of Name
May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest
Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →