Patent Assignment
Reel/Frame 060011/0429
Assignment of Assignor's Interest
Recorded: 2022-05-25
Pages: 6
Assignors
AHN, JAE IN
Executed: 2022-05-19
KIM, KYUNG HWAN
Executed: 2022-05-19
MA, SEONG HWAN
Executed: 2022-05-13
SEO, JANG WON
Executed: 2022-05-19
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing System, Polishing Pad and Method of Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 22, 2022
From: MYUNG, KANG SIK
To: SKC SOLMICS CO., LTD.
Reel/Frame 062188/0420 →
Change of Name
May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest
Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →