Patent Assignment
Reel/Frame 059792/0571
Assignment of Assignor's Interest
Recorded: 2022-05-03
Pages: 6
Assignors
YUN, SUNG HOON
Executed: 2022-04-27
AHN, JAE IN
Executed: 2022-04-27
JOENG, EUN SUN
Executed: 2022-04-27
SEO, JANG WON
Executed: 2022-04-27
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad, Manufacturing Method Thereof, Method for Manufacturing Semiconductor Device Using Same
Application:
17/735,244 →
Publication:
US 2022/0371155
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2022
From: YUN, SUNG HOON; AHN, JAE IN; JOENG, EUN SUN; SEO, JANG WON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059792/0444 →
Change of Name
May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest
Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →