IP Library › Assignment 060425/0648
Patent Assignment
Reel/Frame 060425/0648

Assignment of Assignor's Interest

Recorded: 2022-07-01 Pages: 7
Assignors
YUN, SUNG HOON
Executed: 2022-06-22
SEO, JANG WON
Executed: 2022-06-22
HEO, HYE YOUNG
Executed: 2022-06-22
YUN, JONG WOOK
Executed: 2022-06-22
AHN, JAE IN
Executed: 2022-06-22
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Pad and Method for Manufacturing Semiconductor Device Using the Same
Application: 17/856,649 →
Publication: US 2023/0059394
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 063530/0303 →
Assignment of Assignor's Interest Jun 4, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071308/0411 →