Polishing pad and method for manufacturing semiconductor device using the same
Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polishing surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.
1 . A polishing pad comprising:
a polishing layer comprising a first surface which is a polishing surface and a second surface which is an opposite surface of the first surface, and comprising a first through hole passing through the first surface and the second surface;
a window disposed in the first through hole; and
a support layer disposed on the second surface of the polishing layer, comprising a third surface and a fourth surface which is an opposite surface of the third surface, and comprising a second through hole connected to the first through hole while passing through the third surface and the fourth surface,
wherein the second through hole is smaller than the first through hole,
a lowermost surface of the window is supported by the third surface,
a first adhesive layer is interposed between the lowermost surface of the window and the third surface,
a second adhesive layer is interposed between the second surface and the third surface; and between the lowermost surface of the window and the third surface, and
the support layer comprises a compressed region (CR) in a region corresponding to the lowermost surface of the window,
wherein the first adhesive layer comprises a moisture-cured product of a moisture-curable adhesive composition, and the second adhesive layer comprises a thermoplastic resin,
wherein the moisture-curable adhesive composition comprises:
a urethane-based prepolymer formed from a monomer component comprising
an aromatic diisocyanate represented by Chemical Formula 1; and
a diol having 2 to 10 carbon atoms; and
an unreacted aromatic diisocyanate represented by Chemical Formula 1:
wherein the urethane-based prepolymer is present in an amount of 90 wt % to 99 wt %; and the unreacted aromatic diisocyanate is present in an amount of 1 wt % to 10 wt %,
wherein the compressed region is an integrally formed continuous compressed region extending from a side surface of the second through hole toward an interior of the support layer so as to correspond to the lowermost surface of the window, wherein a lowermost surface of the compressed region is closer to the window than the fourth surface, and
the compressed region does not include two or more compressed regions having different pressurizing directions in the forming process.
2 . The polishing pad of claim 1 , wherein the moisture curable adhesive composition has a viscosity of 5,000 mPa·s to 10,000 mPa·s at 20° C. to 30° C.
3 . The polishing pad of claim 1 , wherein the second adhesive layer comprises an adhesive selected from the group consisting of a thermoplastic urethane-based adhesive, a thermoplastic acrylic adhesive, a thermoplastic silicon-based adhesive, and combinations thereof.
4 . The polishing pad of claim 1 , wherein the second adhesive layer has a thickness of about 15 μm to about 40 μm.
5 . The polishing pad of claim 1 , wherein the first adhesive layer is not disposed between a side surface of the first through hole and a side surface of the window.
6 . The polishing pad of claim 1 , wherein the first adhesive layer is also disposed between a side surface of the first through hole and a side surface of the window.
7 . The polishing pad of claim 1 , wherein the support layer comprises a non-compression region in a region other than the compressed region, and
a percentage of the thickness of the compressed region is 0.01% to 80% with respect to the thickness of the non-compression region.
8 . The polishing pad of claim 1 , wherein a percentage of the thickness of the compressed region with respect to a width of the compressed region is 0.01% to 30%.
9 . The polishing pad of claim 1 , wherein the first surface comprises at least one groove, and
the groove has a depth of 100 μm to 1500 μm and a width of 0.1 mm to 20 mm.
10 . The polishing pad of claim 9 , wherein the first surface comprises a plurality of grooves,
the plurality of grooves comprise concentric circular grooves, and
the concentric circular grooves have a spacing of 2 mm to 70 mm between two adjacent grooves.
11 . The polishing pad of claim 1 , wherein the lowermost surface of the window comprises a recessed portion.
12 . The polishing pad of claim 11 , wherein the recessed portion has a depth of 0.1 mm to 2.5 mm.
13 . The polishing pad of claim 1 , wherein the window comprises a non-foamed cured product of a window composition comprising a first urethane-based prepolymer, and
the polishing layer comprises a foamed cured product of a polishing layer composition comprising a second urethane-based prepolymer.
14 . The polishing pad of claim 1 , wherein a shore D hardness measured at the first surface in a room temperature dry state is smaller than a shore D hardness measured at an uppermost surface of the window in the room temperature dry state.