Patent Assignment
Reel/Frame 061376/0240
Assignment of Assignor's Interest
Recorded: 2022-10-11
Pages: 6
Assignors
SEO, JANG WON
Executed: 2022-10-06
YUN, SUNG HOON
Executed: 2022-10-06
JOENG, EUN SUN
Executed: 2022-10-06
AHN, JAE IN
Executed: 2022-10-06
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784,, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad and Preparing Method of Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.