Patent Assignment
Reel/Frame 058327/0447
Assignment of Assignor's Interest
Recorded: 2021-12-07
Pages: 6
Assignors
YUN, SUNG HOON
Executed: 2021-12-01
KIM, KYUNG HWAN
Executed: 2021-12-01
AHN, JAE IN
Executed: 2021-12-01
SEO, JANG WON
Executed: 2021-12-01
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad Sheet, Polishing Pad, and Method for Manufacturing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.