Patent Assignment
Reel/Frame 060582/0380
Assignment of Assignor's Interest
Recorded: 2022-07-21
Pages: 9
Assignors
HONG, SEUNG CHUL
Executed: 2022-07-12
HAN, DEOK SU
Executed: 2022-07-12
PARK, HAN TEO
Executed: 2022-07-12
KIM, KYU HUN
Executed: 2022-07-12
JOENG, EUN SUN
Executed: 2022-07-12
KWON, JANG KUK
Executed: 2022-07-12
LEE, HYEONG JU
Executed: 2022-07-12
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Pad and Method for Manufacturing Semiconductor Device Using Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.