Patent Assignment
Reel/Frame 063844/0708
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 6
Assignors
PARK, HAN TEO
Executed: 2023-05-25
HAN, DEOK SU
Executed: 2023-05-25
KWON, JANG KUK
Executed: 2023-05-25
HONG, SEUNG CHUL
Executed: 2023-05-25
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Composition for Semiconductor Processing Polishing Composition Preparation Method, and Semiconductor Device Manufacturing Method to Which Polishing Composition Is Applied
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.