Patent Assignment
Reel/Frame 063841/0856
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 3
Assignors
HSIN, BO-HUAN
Executed: 2023-05-29
CHIOU, YING-HAN
Executed: 2023-05-29
TSAI, MING-YEN
Executed: 2023-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Capable of Releasing Process Charge, and Method for Manufacturing the Same
Application:
18/328,096 →
Publication:
US 2024/0405127